Semiconductor Packaging Process. Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab.

Name: Semiconductor Packaging Process Close-up Silicon Die
Uploaded: 2023-02-06T00:00:00.000Z
Duration: 9 s
Channel: IM Imagery
Description: Semiconductor Packaging Process. Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Stock Footage Video (100% Royalty-free) 1099853287 | Shutterstock