Semiconductor Packaging Process. Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab.

Name: Semiconductor Packaging Process Close-up Silicon Die
Uploaded: 2023-01-20T00:00:00.000Z
Duration: 8 s
Channel: IM Imagery
Description: Semiconductor Packaging Process. Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Stock Footage Video (100% Royalty-free) 1099203345 | Shutterstock

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IM Imagery

Semiconductor Packaging Process. Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab.

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